
Work Project
Thermal Redesign Journey
Thermal path · field reliability
Situation / Problem
Field overheating pushed returns past a sustainable rate; needed a real fix to the thermal path, not a workaround.
Action
Phase 1: airflow + grill work (Flow Simulation + physical validation). Phase 2: stack upgrade (package + all-metal heatsink) to remove the junction-to-case bottleneck.
Result
−16 °C chip temp; returns under 3%; both phases shipped; ~+50% operating power vs prior gen.
Skills learned / applied
Thermal AnalysisFlow SimulationRCA / FMEADesign iterationDFMPhysical validation
















